Content

News Articles

PRESS RELEASE
26-Jul-2011
Laird Technologies Publishes Thermal Management for Medical Lasers Application Note
 
 
Thermoelectric Modules & Assemblies for Medical Laser Applications
St. Louis, Missouri, USA – July 25, 2011 – Laird Technologies, Inc., a global leader in the design and supply of customized performance-critical components and systems for advanced electronics and wireless products, today announced the release of its newest application note titled “Thermoelectric Modules & Assemblies for Medical Laser Applications”. This application note is the newest in a series of notes describing the role of Thermal Management in numerous market segments.
 
The application note describes why Thermoelectric Modules (TEMs) and Thermoelectric Assemblies (TEAs) are ideal thermal management solutions for many medical laser applications such as CO2 lasers, YAG lasers, dye lasers, excimer lasers, free electron lasers, diode lasers and fiber lasers. Thermoelectrics are used keep the laser optics stable at peak performance by controlling the operating temperature of the medical laser to within defined parameters. Excess waste heat generated from the laser system is removed by offering cooling below ambient. The products also offer reliable solid-state operation, which results in long service life with low maintenance requirements.
 
“Thermoelectrics make an excellent thermal management solution for medical laser applications due to the high cooling performance achieved in a compact form factor and precise temperature control to maximize temperature stabilization of a laser head.” stated Andrew Dereka, Laird Technologies Thermoelectrics Product Manager. “This cannot be accomplished by any other means without a complex heating and cooling system.” 
 
Thermal management of medical laser components and systems are now more challenging. Power densities continue to increase while product form factors continue to shrink.  Simple thermal management solutions, such as adding a fan or heat sink, are no longer typically viable to meet required performance and reliability specifications. In today’s complex medical operating environment, TEMs, TEAs and chillers are necessary to provide precision cooling and heating in a variety of modular platforms.
 
As an industry leader in high-performance and cost-effective Thermal Management Solutions, Laird Technologies provides the knowledge, innovation, and resources to ensure exceptional thermal performance and customer satisfaction for applications in the medical, analytical, telecom, industrial, and consumer markets.
 
The application note is available free for download on Lairdtech.com.
 
About Laird Technologies, Inc.
Laird Technologies designs and manufactures customized, performance-critical products for wireless and other advanced electronics applications.
 
The company is a global market leader in the design and supply of electromagnetic interference (EMI) shielding, thermal management products, specialty metal products, signal integrity components, and antenna solutions, as well as radio frequency (RF) modules and wireless remote controls and systems. 
 
Custom products are supplied to all sectors of the electronics industry including the handset, telecommunications, data transfer and information technology, automotive, aerospace, defense, consumer, medical, mining, railroad and industrial markets.
 
Laird Technologies, a unit of Laird PLC, employs over 12,000 employees in more than 49 facilities located in 16 countries.

 OTHER NEWS
 
• Do Connected Cars Deserve Our Trust?
• Smart Parking Eases Congestion
• Big Data Hits the Road with Fleets
• ORBCOMM LAUNCHES DIVERSE PORTFOLIO OF
• Take Connectivity to the Road
• u-blox introduces TOBY-L1 series, world’s smallest multi-band 4G LTE-only modules
• M2M, IP, and Communities of Devices
• ThingWorx and Acumen Solutions Partner to Extend the Enterprise to the World of Smart Sensors, Devices, and Machines
• u-blox announces collaboration with Intel on dedicated HSPA module
• Smart Grid Impact Grows
• New M2M Developments Offer Convenience, Flexibility
• Digi International Deploys 500-Node Internet of Things Network for the Data Sensing Lab at Google I/O
 
 
 LATEST NEWS
News Analysis:
Do Connected Cars Deserve Our Trust?
Smart Parking Eases Congestion
Big Data Hits the Road with Fleets
Take Connectivity to the Road
M2M, IP, and Communities of Devices
Press Releases:
ORBCOMM LAUNCHES DIVERSE PORTFOLIO OF
u-blox introduces TOBY-L1 series, world’s smallest multi-band 4G LTE-only modules
ThingWorx and Acumen Solutions Partner to Extend the Enterprise to the World of Smart Sensors, Devices, and Machines
u-blox announces collaboration with Intel on dedicated HSPA module
Digi International Deploys 500-Node Internet of Things Network for the Data Sensing Lab at Google I/O
 FEATURED ARTICLES
 
Partnering for Smarter Appliances
Telematics: A Transformative Economic Catalyst
Using the Network for Updating
Reducing the Risk with M2M
M2M Legislative Update