Content

News Articles

PRESS RELEASE
24-May-2012
Two Telit 3G M2M Modules Earn AT&T Certification
 
 
HE863-NAG & H24 HSPA Cellular Modules to Enable High-Bandwidth Applications for Long-Term Deployment in U.S.
Raleigh, NC – May 23, 2012 – Telit Wireless Solutions, a leading global provider of high-quality machine-to-machine (M2M) modules and services, announced today that its HE863-NAG and H24 cellular modules received AT&T certification.  Supporting rapid data transfer speeds over the carrier’s HSPA network and featuring universally low power consumption, these modules will enable M2M integrators to deploy high-bandwidth applications and extend the life of their devices with 3G-based designs.

The HE863-NAG is the third module from the HE863 family to earn AT&T certification, joining the ranks of the -NAD and -NAR.  Within the same lightweight, compact ball-grid-array (BGA) form factor, this variant uniquely features the greatest functionality within the family, including integrated high sensitivity GPS receiver that supports simultaneous GPS with voice and data.

Telit’s H24 offers the same high-speed HSUPA/HSDPA connectivity (5.76Mbps up / 7.2 Mbps down) with on-board GPS, making both modules ideal for robust location-based solutions such as automotive infotainment.

“While M2M has traditionally been a 2G market, high-speed 3G technology enables a new range of feature-rich applications for both consumer and commercial adopters, ranging from in-vehicle entertainment to video security solutions,” said Mike Ueland, senior vice president and general manager of Telit Wireless Solutions North America.  “Our modules paired with the reliable service of AT&T’s high speed network create the perfect platform for the next wave of M2M device design and innovation.”

Both modules feature backwards compatibility with GSM/GPRS/EDGE networks, serving as a fallback for applications to maintain connectivity in areas where the high-speed 3G network is unavailable.  The H24 also features the same form factor as the Telit G24 module, providing an easy path for current integrators to migrate their devices from 2G to 3G without reengineering the product.  For more information about these products, visit www.telit.com.

About Telit
Telit Wireless Solutions is a brand of Telit Communications PLC (AIM: TCM), an enabler of machine-to-machine (M2M) communications worldwide providing wireless module technology, services and connectivity. Exclusively dedicated to M2M with more than 12 years of experience in the market, the company constantly enhances its technology leadership with six R&D centers across the globe. Telit offers an extensive portfolio of the highest quality cellular, short-range RF, and GNSS modules, available in over 80 countries. By supplying scalable products that are interchangeable across families, technologies and generations, Telit is able to keep development costs low and protect customers' design investments. In addition, Telit is the only module provider in the market today to offer a value added services bundle including connectivity dedicated to simplifying the deployment of M2M applications.
Telit provides unmatched customer support and premier design-in expertise through its 25 sales and support offices, a global distributor network of wireless experts with more than 30 Telit-designated Competence Centers, and its online Telit Technical Support Forum.
Telit technology enables organizations to wirelessly collect, process and respond to real-time data from vending machines, utility meters, cars, remote health monitors and any other connected devices, creating new efficiencies and revenue opportunities as well as societal and personal benefits. Further information about Telit and its products can be found at www.telit.com. Join the conversation and learn more about Telit and its customers’ innovative applications on Facebook and Twitter.
 # # #

Press Contacts:
Lara Levin
Bob Gold & Associates (Telit U.S. Media Relations)
310-784-1040
lara@bobgoldpr.com
 OTHER NEWS
 
• ORBCOMM LAUNCHES DIVERSE PORTFOLIO OF
• Take Connectivity to the Road
• u-blox introduces TOBY-L1 series, world’s smallest multi-band 4G LTE-only modules
• M2M, IP, and Communities of Devices
• ThingWorx and Acumen Solutions Partner to Extend the Enterprise to the World of Smart Sensors, Devices, and Machines
• u-blox announces collaboration with Intel on dedicated HSPA module
• Smart Grid Impact Grows
• New M2M Developments Offer Convenience, Flexibility
• Digi International Deploys 500-Node Internet of Things Network for the Data Sensing Lab at Google I/O
• TI delivers industry’s most integrated ZigBee® single-chip solution with an ARM® Cortex™-M3 microcontroller (MCU) for smart energy infrastructure, home and building automation, and intelligent lighting systems
• Telit Leverages m2mAIR’s North America Carrier Relationships to Minimize Wireless Barriers
• GateTel and Telit Expand Cooperation into North America with HSPA+ and EV-DO Cellular and GNSS Terminals
 
 
 LATEST NEWS
News Analysis:
Take Connectivity to the Road
M2M, IP, and Communities of Devices
Smart Grid Impact Grows
New M2M Developments Offer Convenience, Flexibility
Air Travel Transformed
Press Releases:
ORBCOMM LAUNCHES DIVERSE PORTFOLIO OF
u-blox introduces TOBY-L1 series, world’s smallest multi-band 4G LTE-only modules
ThingWorx and Acumen Solutions Partner to Extend the Enterprise to the World of Smart Sensors, Devices, and Machines
u-blox announces collaboration with Intel on dedicated HSPA module
Digi International Deploys 500-Node Internet of Things Network for the Data Sensing Lab at Google I/O
 FEATURED ARTICLES
 
Partnering for Smarter Appliances
Telematics: A Transformative Economic Catalyst
Using the Network for Updating
Reducing the Risk with M2M
M2M Legislative Update